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Saturday, May 2, 2020 | History

4 edition of Electronic packaging and interconnection handbook found in the catalog.

Electronic packaging and interconnection handbook

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  • 3 Currently reading

Published by McGraw-Hill in New York .
Written in English

    Subjects:
  • Electronic packaging -- Handbooks, manuals, etc.

  • Edition Notes

    Includes bibliographical references and index.

    StatementCharles A.Harper, editor-in-chief.
    ContributionsHarper, Charles A. 1926-
    Classifications
    LC ClassificationsTK7870.15
    ID Numbers
    Open LibraryOL20946914M
    ISBN 100070266840


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Electronic packaging and interconnection handbook Download PDF EPUB FB2

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Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to.

Electronic Packaging and Interconnection Handbook September September Read More. Author: Charles Harper; Publisher: McGraw-Hill, Inc.

Professional Book Group 11 West 19th Street New York, NY Citation count. Downloads (6 weeks) 0. Downloads (12 months) 0. Downloads (cumulative) 0. Sections. Electronic Packaging and. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics.

Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data.

Covering every aspect of electronic packaging from development and design to manufacturing, facilities, and testing, Electronic Packaging and Interconnection Handbook, Third Edition, continues to be the standard reference in its field.

Materials'for High-Density Electronic Packagting and Interconnection NMAB Committee on Materials for High-Density Electronic Packaging - T 14i~ EO~ ~~ ~s cou '1~~ft AprilIb6CV~S 10 1.

supauugnyT~r NOTATION COSATI cools Ib- su"iCi TUIaS 4(C an w'ew 0' uem, o 4%fq IVFile Size: 7MB. This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field.

This edition features over 50% new material, deleting many chapters entirely and bringing in new, state-of-the-art material on interconnection technologies, multichip modules, BGA, and other new areas.

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The Electronic Packaging and Interconnection Handbook is a good book, covering a broad range of topics that will fill-in the gaps of knowledge between other books on your book shelf.4/5. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, "Electronic Packaging and Interconnection Handbook" offers a unique source of key reference data, practical guidance, and circuit and package design basics.

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New York, NY, USA © ISBN Book Bibliometrics Citation Count: 3 Downloads (cumulative): n/a Cited by: From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics.

Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging /5(3). ISBN: OCLC Number: Description: 1 volume: illustrations ; 24 cm: Contents: Electronic Packaging Defined --Fundamental Technologies --Materials for Electronic Packaging --Polymers for Electronic Packaging --Future Electronic Packaging System Needs --Recent Advancements in Polymeric Materials for Electronic Packaging --Polymeric Materials For.

ISBN: OCLC Number: Description: 1 volume (various pagings): illustrations ; 24 cm. Contents: Electronic Packaging Defined --Fundamental Technologies --Materials for Electronic Packaging --Polymers for Electronic Packaging --Future Electronic Packaging System Needs --Recent Advancements in Polymeric Materials for Electronic Packaging --Polymeric.

Online shopping for Electronic Packaging from a great selection at Books Store. This handbook is a complete, comprehensive reference to all aspects of electronic packaging, from fundamentals to systems. It provides in-depth coverage of this interdisciplinary field, combining electrical, electronics, mechanical and materials principles and techniques.

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Here, in this single information-packed resource are all the data and guidelines you need for all types and. THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING COMPLETELY UPDATED.

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling /5(3). : Electronic Packaging and Interconnection Handbook 4/E () by Harper, Charles and a great selection of similar New, Used and Collectible Books available now at 4/5(2).

CONFERENCE PROCEEDINGS Papers Presentations Journals. Advanced Photonics Journal of Applied Remote Sensing. This book is a highly recommended reference for all mechanical (and, I suppose, some electrical) engineers working on packaging.

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Electronic packaging and interconnection handbook in SearchWorks catalog Skip to search Skip to main content. Electronic packaging can be classified into several packaging levels as shown in Fig.

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